I. Journal Papers
1. Fan-Yi Ouyang*, K. N. Tu, Yi-Shao Lai, and Andriy M. Gusak, “Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration.” Appl. Phys. Lett., 89, 221906 (2006).
2. Fan-Yi Ouyang*, Kai Chen, K. N. Tu, and Yi-Shao Lai, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Appl Phys. Lett., 91, 231919 (2007).
3. Fan-Yi Ouyang*, K. N. Tu, Chin-Li Kao, and Yi-Shao Lai, “Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints,” Appl. Phys. Lett., 90, 211914 (2007).
4. Jia-Hong Huang*, Fan-Yi Ouyang, G. P. Yu, “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin film on AISI D2 steel.”,Surface and Coatings Technology, 201, 7043 (2007).
5. Matt Pharr, Kejie Zhao, Zhigang Suo*, Fan-Yi Ouyang and Pilin Liu. “Concurrent electromigration and creep in lead-free solder"." Journal of Applied Physics 110, 083716 (2011).
6. Fan-Yi Ouyang*, and C.-L. Kao, “In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints”, " Appl. Phys., 110, 123525 (2011)
7. Fan-Yi Ouyang*, Hao Hsu, Yu-ping Su and Tao-Chih Chang, “Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging”, J. Appl. Phys., 110, 123525 (2012)
8. Fan-Yi Ouyang*, K.N. Tu and Yi-Shao Lai, “Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints”, Materials Chemistry and physics, 136, 210 (2012)
9. Hsin-Fang Lee, Ji-Jung Kai, Pang-Chun Liu, Wei-Chen Chang, Fan-Yi Ouyang, and Hsiu-Ting Chan, “A comparative study of charge transport in quasi-solid state dye-sensitized solar cells using polymer or nanocomposite gel electrolytes”, Journal of Electroanalytical Chemistry 687 45–50 (2012)
10. Chih Chen*, Hsiang-Yao Hsiao, Yuan-Wei Chang, Fan-Yi Ouyang*, and K. N. Tu “Thermomigration in Solder Joint”, Materials Science & Engineering R, 73, 85 (2012)
11. Fan-Yi Ouyang*, and Wei-Cheng Jhu, “Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits”, J. Appl. Phys., 113, 043711 (2013)
12. Fan-Yi Ouyang*, Chi-Hung Chang, Bo-Chien You, Tsung-Kuang Yeh and Ji-Jung Kai, “Effect of moisture on corrosion of Ni- based Alloys in Molten Alkali Fluoride FLiNaK Salt Environments”, Journal of nuclear materials, 437 (2013) 201–207.
13. Hsin-Fang Lee, Jhih-Lin Wu,Po-ya Hsu, Yung-Liang Tung, Fan-Yi Ouyang, Ji-Jung Kai, “Enhanced photovoltaic performance and long-term stability of dye-sensitized solar cells by incorporating SiO2 nanoparticles in a binary ionic liquid electrolyte ”, Thin Solid Films 529, 2–6 (2013)
14. Fan-Yi Ouyang*, and Wei-Lun Tai, “Enhanced corrosion resistance of TiN-coated stainless steels for the application in flexible dye-sensitized solar cells”, Appl. Surface Science.,276, 563–570 (2013).
15. Hsin-Fang Lee, Yi-Ting Chua, Sz-Min Yang, Po-Ya Hsu, Yung-Liang Tung, Fan-Yi Ouyang and Ji-Jung Kai “Efficient, stable, and flexible dye-sensitized solar cells based on nanocomposite gel electrolytes, Thin Solid Films 544 (2013) 301–306
16. Fan-Yi Ouyang*, and Wei-Cheng Jhu, "Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits", Journal of Alloys and Compounds , 580 (2013) 114–119.
17. Tsung-Han Yang, Yu-Min Lin, and Fan-Yi Ouyang*, " Joule heating induced damage for Cu-Al wedge bonding under current stressing "," Journal of Electronic materials, 43, 270-276 (2014).
18.Fan-Yi Ouyang*, Yu-Sheng Wang, Mei-Ya Wang, Bo-Chien You, Tsung-Kuang Yeh, and Ji-Jung Kai " Influence of purification process on incipient material corrosion in molten FLiNaK salts ", Corrosion Engineering Science and Technology, In Press
19. Hao Hsu, Tzu-Yang Lin and Fan-Yi Ouyang*, " Evaluation of electromigration behaviors for Pb-free microbumps in three-dimensional integrated circuits packaging,” Journal of electronic materials, 43, 236-246 (2014).
20. Fan-Yi Ouyang*, Chi-Hung Chang, and Ji-Jung Kai, “Long-term corrosion behaviors of Hastelloy-N and Hastelloy-B3 in moisture-containing molten FLiNaK salt environments,” Journal of nuclear materials, 446, 81-89 (2014).
21. Wei-Neng Hsu and Fan-Yi Ouyang*, “Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient,” Acta Materialia, 81, 141-150 (2014).
22. Shih-Hsun Lin and Fan-Yi Ouyang*, “Enhanced electromigration resistance of Pb-free solders by using Cu/Sn composite structure,” Journall of The Minerals, Metals & Materials (JOM), In Press.
2. Fan-Yi Ouyang*, Kai Chen, K. N. Tu, and Yi-Shao Lai, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Appl Phys. Lett., 91, 231919 (2007).
3. Fan-Yi Ouyang*, K. N. Tu, Chin-Li Kao, and Yi-Shao Lai, “Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints,” Appl. Phys. Lett., 90, 211914 (2007).
4. Jia-Hong Huang*, Fan-Yi Ouyang, G. P. Yu, “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin film on AISI D2 steel.”,Surface and Coatings Technology, 201, 7043 (2007).
5. Matt Pharr, Kejie Zhao, Zhigang Suo*, Fan-Yi Ouyang and Pilin Liu. “Concurrent electromigration and creep in lead-free solder"." Journal of Applied Physics 110, 083716 (2011).
6. Fan-Yi Ouyang*, and C.-L. Kao, “In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints”, " Appl. Phys., 110, 123525 (2011)
7. Fan-Yi Ouyang*, Hao Hsu, Yu-ping Su and Tao-Chih Chang, “Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging”, J. Appl. Phys., 110, 123525 (2012)
8. Fan-Yi Ouyang*, K.N. Tu and Yi-Shao Lai, “Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints”, Materials Chemistry and physics, 136, 210 (2012)
9. Hsin-Fang Lee, Ji-Jung Kai, Pang-Chun Liu, Wei-Chen Chang, Fan-Yi Ouyang, and Hsiu-Ting Chan, “A comparative study of charge transport in quasi-solid state dye-sensitized solar cells using polymer or nanocomposite gel electrolytes”, Journal of Electroanalytical Chemistry 687 45–50 (2012)
10. Chih Chen*, Hsiang-Yao Hsiao, Yuan-Wei Chang, Fan-Yi Ouyang*, and K. N. Tu “Thermomigration in Solder Joint”, Materials Science & Engineering R, 73, 85 (2012)
11. Fan-Yi Ouyang*, and Wei-Cheng Jhu, “Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits”, J. Appl. Phys., 113, 043711 (2013)
12. Fan-Yi Ouyang*, Chi-Hung Chang, Bo-Chien You, Tsung-Kuang Yeh and Ji-Jung Kai, “Effect of moisture on corrosion of Ni- based Alloys in Molten Alkali Fluoride FLiNaK Salt Environments”, Journal of nuclear materials, 437 (2013) 201–207.
13. Hsin-Fang Lee, Jhih-Lin Wu,Po-ya Hsu, Yung-Liang Tung, Fan-Yi Ouyang, Ji-Jung Kai, “Enhanced photovoltaic performance and long-term stability of dye-sensitized solar cells by incorporating SiO2 nanoparticles in a binary ionic liquid electrolyte ”, Thin Solid Films 529, 2–6 (2013)
14. Fan-Yi Ouyang*, and Wei-Lun Tai, “Enhanced corrosion resistance of TiN-coated stainless steels for the application in flexible dye-sensitized solar cells”, Appl. Surface Science.,276, 563–570 (2013).
15. Hsin-Fang Lee, Yi-Ting Chua, Sz-Min Yang, Po-Ya Hsu, Yung-Liang Tung, Fan-Yi Ouyang and Ji-Jung Kai “Efficient, stable, and flexible dye-sensitized solar cells based on nanocomposite gel electrolytes, Thin Solid Films 544 (2013) 301–306
16. Fan-Yi Ouyang*, and Wei-Cheng Jhu, "Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits", Journal of Alloys and Compounds , 580 (2013) 114–119.
17. Tsung-Han Yang, Yu-Min Lin, and Fan-Yi Ouyang*, " Joule heating induced damage for Cu-Al wedge bonding under current stressing "," Journal of Electronic materials, 43, 270-276 (2014).
18.Fan-Yi Ouyang*, Yu-Sheng Wang, Mei-Ya Wang, Bo-Chien You, Tsung-Kuang Yeh, and Ji-Jung Kai " Influence of purification process on incipient material corrosion in molten FLiNaK salts ", Corrosion Engineering Science and Technology, In Press
19. Hao Hsu, Tzu-Yang Lin and Fan-Yi Ouyang*, " Evaluation of electromigration behaviors for Pb-free microbumps in three-dimensional integrated circuits packaging,” Journal of electronic materials, 43, 236-246 (2014).
20. Fan-Yi Ouyang*, Chi-Hung Chang, and Ji-Jung Kai, “Long-term corrosion behaviors of Hastelloy-N and Hastelloy-B3 in moisture-containing molten FLiNaK salt environments,” Journal of nuclear materials, 446, 81-89 (2014).
21. Wei-Neng Hsu and Fan-Yi Ouyang*, “Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient,” Acta Materialia, 81, 141-150 (2014).
22. Shih-Hsun Lin and Fan-Yi Ouyang*, “Enhanced electromigration resistance of Pb-free solders by using Cu/Sn composite structure,” Journall of The Minerals, Metals & Materials (JOM), In Press.
II. Conference Proceedings
C1. Fan-Yi Ouyang*, A.T. Huang, and K.N. Tu, “Thermomigration in SnPb composite solder joints and wires,” Electronic Components and Technology Conference, 2006. Proceedings. 56th, 1974-1978 (2006).
C2. Chin-Li Kao, Fan-Yi Ouyang, Yi-Shao Lai, and Chang-Lin Yeh, “ Electrothermal coupling analysis for electromigration mechanism of flip chip packages,” 2007 Taiwan ANSYS User conference, 195-197 (2007).
C3. Jia-Hong Huang, Fan-Yi Ouyang, G-P Yu, (2005) “Effect of Film Thickness and Ti Interlayer Thickness on the Structure and Properties of Nanocrystalline TiN Thin Film Deposited by Unbalanced Magnetron (UBM) Sputtering,” 2005 ICMCTF meeting, San Diego, California, USA
C4. Fan-Yi Ouyang and King-Ning Tu, “Thermomigration of Pb in eutectic SnPb flip chip solder joints,” 2007 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition, Orlando, Florida, USA (2007)
C5. Fan-Yi Ouyang and King-Ning Tu, “Recrystallization Induced Microstructure Change in Eutectic SnPb Flip Chip Solder Joints by Electromigration,” 2008 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition, New Orleans, Louisiana, USA (2008)
C6. Fan-Yi Ouyang and King-Ning Tu, “Thermo-Electromigration Induced Sn Whisker Growth in Pb-Free Flip Chip Solder Joints,” 2008 The Minerals, Metals and Materials Society (TMS) Annual Meeting and Exhibition, New Orleans, Louisiana, USA (2008)
C7. Pilin Liu, Fan-Yi Ouyang, Emily Ou, Jung-Kyu Han, Gerry Leatherman, Zezhong Fu, Jun He and Goyal Deepak, “ Electromigration (EM) of Solder Joint in Electronic Packaging, ” 2008 ASME international mechanical engineering congress and exposition conference, Boston, Massachusetts, USA (2008).
C8. Pilin Liu, Fan-Yi Ouyang, Shengquan Ou, Zezhong Fu, and Deepak Goyal," Solder Joint Electromigration Mechanisms ," 2009 InterPACK conference, San Francisco, USA(2009).
C9. Fan-Yi Ouyang, Pilin Liu, Matt Pharr, Kejie Zhao, and Zhigang Suo, "Effect of solder bump heights on Cu dissolution rate in Pb-free Flip chip solder joints by electromigration," 2011 The Minerals, Metals & Materials Society (TMS) Meeting, San Diego, CA, USA ( 2011)
C10. Wei-Lun Tai, Hsin-Fang Lee and Fan-Yi Ouyang, “Corrosion resistance of TiN films on flexible stainless steel substrate for dye-sensitized solar cells applications", TACT 2011- International Thin Films conference, Kenting, Taiwan (2011).
C11. Jhih-Lin Wu, Hsin-Fang Lee, Fan-Yi Ouyang and Ji-Jung Kai, “Fabrication of highly efficient flexible dye-sensitized solar cells based on ionic gel electrolytes”, TACT 2011-International Thin Films Conference, Kenting, Taiwan (2011).
C12. Po-Ya Hsu, Hsin-Fang Lee, Jhih-Lin Wu, Fan-Yi Ouyang and Ji-Jung Kai, “Quasi-solid state dye-sensitized solar cells with solvent-free ionic gel electrolytes”, TACT 2011-International Thin Films Conference, Kenting, Taiwan (2011).
C13. Po-Ya Hsu, Hsin-Fang Lee, Jhih-Lin Wu, Fan-Yi Ouyang and Ji-Jung Kai, “Fabrication and Photoelectrochemical Properties of TiO2 films on ITO/PEN Substrate for Flexible Quasi-solid-state Dye-sensitized Solar Cells,” The 6th Aceanian Conference on Dye-sensitized and Organic Solar Cells (DSC-OPV-6), Beppu, Oita, Kyushu Island, Japan(2011).
C14. Jhih-Lin Wu, Hsin-Fang Lee, Yung-Liang Tung, Po-Ya Hsu, Fan-Yi Ouyang and Ji-Jung Kai, “Plastic-Substrate Dye-sensitized Solar Cells Employing a Solvent‐Free Ionic Gel Electrolyte,” The 6th Aceanian Conference on Dye-sensitized and Organic Solar Cells (DSC-OPV-6), Beppu, Oita, Kyushu Island, Japan (2011).
C15. Fan-Yi Ouyang*, Hao Hsu, K. N. Tu, Yi-Shao Lai, “Effect of Entropy Production on Microstructure Change in Flip Chip Solder Joints by Joule Heating in Electromigration”, IUMRS-ICA 2011 12th International Conference in Asia, 0727(2011).
C16. Fan-Yi Ouyang,* Wei-Cheng Jhu, Yi-Shao Lai, and C.-L. Kao, “Thermomigration of Sn in 96.5Sn-3Ag-0.5Cu flip chip solder joints”, IUMRS-ICA 2011 12th International Conference in Asia, 0631(2011).
C17. Hsin-Fang Lee, Pang-Chun Liu, Yung-Liang Tung, Shih-Hsiang Chiu, Fan-Yi Ouyang and Ji-Jung Kai, “Effect of TiO2 Nanoparticles in Electrolytes on the Performance of Quasi-solid-state Dye-sensitized Solar Cells”, IUMRS-ICA 2011 12th International Conference in Asia, 0872,Taipei, Taiwan (2011).
C18. Hsin-Fang Lee, Jhih-Lin Wu, Yung-Liang Tung, Syuan Li, Fan-Yi Ouyang and Ji-Jung Kai, “Highly Stable Dye-sensitized Quasi-solid State Solar Cell with Solvent-free Binary Ionic Electrolytes Solidified by SiO2 Nanoparticles,” IUMRS-ICA 2011 12th International Conference in Asia, 0960, Taipei, Taiwan (2011).
C19. Po-Ya Hsu, Hsin-Fang Lee, Sz-Min Yang, Yi-Ting Chua, Pang-Chun Liu, Yung-Liang Tung, Fan-Yi Ouyang and Ji-Jung Kai, “Highly Efficient Quasi-solid State Flexible Dye-sensitized Solar Cells Using a Compression Method and Light-confined Effect for Preparation of TiO2 Photoelectrodes,” IUMRS-ICA 2011 12th International Conference in Asia, 0965, Taipei, Taiwan (2011).
C20. Hao Hsu and Fan-Yi Ouyang, " Observation on electromigration induced nanoscale lamellar microstructure change in eutectic SnPb flip chip solder joints," AMD fusion 7th Annual Technical Forum & Exhibition, Taipei, Taiwan (2011)
C21. Wei-Cheng Jhu and Fan-Yi Ouyang, " Thermomigration in Pb-free flip chip solder joints" AMD fusion 7th Annual Technical Forum & Exhibition, Taipei, Taiwan (2011)
C22. Wei-Cheng Jhu and Fan-Yi Ouyang, “Thermomigration on 3D IC Pb-free micro bumps”, 2012 The Minerals, Metals & Materials Society (TMS) Meeting, Orlando, FL, USA (2012)
C23. Hao Hsu and Fan-Yi Ouyang, "Comparison of electromigration induced failure between 3D IC and flip chip solder joints", 2012 The Minerals, Metals & Materials Society (TMS) Meeting, Orlando, FL, USA (2012)
C24. Hsin-Fang Lee, Yi-Ting Chua, Fan-Yi Ouyang, Po-Ya Hsu, Yung-Liang Tung and Ji-Jung Kai," Fabrication of highly efficient flexible dye-sensitized solar cells based on nanocomposite gel electrolytes", 6th International conference on technological advances of thin films and surface coating, Singapore (2012)
C25. Hsin-Fang Lee, Su-Ming Yang, Fan-Yi Ouyang, Po-Ya Hsu, and Ji-Jung Kai," Deposition of platinum on metallic sheets as efficient counter electrodes for flexible dye-sensitized solar cells", 6th international conference on technological advances of thin films and surface coating, Singapore (2012)
C26. Fan-Yi Ouyang* and Wei-Lun Tai “Improved corrosion resistance of flexible dye-sensitized solar cells by introducing a nanocrystallline TiN barrier on stainless steel substrate,” 16th Asian pacific corrosion control conference (APCCC), Kaohsiung, Taiwan (2012).
C27. Fan-Yi Ouyang and Wei-Cheng Juh, “Effect of bump height on thermomigration induced Kirkendall voids on the Pb-free flip chip solder joint and three dimensional integrated circuits packaging,” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C28. Wei-Lun Tai and Fan-Yi Ouyang, “Improved performance of metal-based dye-sensitized solar cells by introducing a TiN nanocrystalline thin film,” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C29. Yzu-Yang Lin, Fan-Yi Ouyang and Wei-Cheng Juh, “Thermomigration induced fast dissolution of interstitial Ni in three-dimensional integrated circuits packaging,” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C30. Wei-Neng Hsu and Fan-Yi Ouyang, “Grain Rotation Induced by Thermomigration in the Pb-free Solders” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C31. Yu-Ping Su and Fan-Yi Ouyang, “The Redistribution of Ag3Sn Phase of Pb-Free Solder in a Temperature Gradient,” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C32. Zong-Han Yang and Fan-Yi Ouyang, “Microstructural evolution of Cu wedge bonding on the Al metallization under a high current density,” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C33. Kai-Hung Yang and Fan-Yi Ouyang, “Effect of temperature on the structure and corrosion properties of nano-twin Cu thin film deposited by unbalanced magnetron (UBM) sputtering,” 2013 The Minerals, Metals & Materials Society (TMS) Meeting, San Antonio, TX, USA ( 2013)
C34. Fan-Yi Ouyang and Wei-Cheng Jhu, “Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect,” 2013 Straits forum on advanced microelectronics packaging material development, Ximan, China (2013). (Invited)
C35. Fan-Yi Ouyang, “Corrosion of Nickel and Iron Based Superalloys in High Temperature Gas Environments,” International Workshop on Advanced Nuclear Reactor Safety Technology, Hsinchu, Taiwan (2013) (Invited)
C36. Wei-Neng Hsu, Wei-Cheng Jhu and Fan-Yi Ouyang*, “Thermomigration in microbumps of three-dimensional integrated Circuit packaging,” International microsystems, packaging, assembly and circuit technology conference (IMPACT), Taipei, Taiwan (2013).
C37. Mulaine Shih, Yu-Ping Su and Fan-Yi Ouyang*, “Thermomigration of Ag in Pb-free SnAg solder joints,” International microsystems, packaging, assembly and circuit technology conference (IMPACT), Taipei, Taiwan (2013)
C38. Shen-Chang Lee, Yi-Lun Tsai, Chieh-Fu Chen and Fan-Yi Ouyang*, “Interfacial reaction in Cu/Pb-free solders/Co couples during reflowing process,” International microsystems, packaging, assembly and circuit technology conference (IMPACT), Taipei, Taiwan (2013).
C39. Fan-Yi Ouyang and Kai Hung Yang, “Controlling the orientation of nano-twined Cu thin film deposited by unbalanced magnetron (UBM) sputtering,” TACT 2013 International Thin Films Conference, Taipei, Taiwan (2013)
C40. Fan-Yi Ouyang, “High-performance flexible dye-sensitized solar cells,” 3rd joint symposium of national Tsing Hua university and University of Liverpool on energy materials, Liverpool, UK (2013) (Invited)
C41. Suz-Min Yang, Hsin-Fang Lee, Po-Ya Hsu, Fan-Yi Ouyang and Ji-Jung Kai, “Different Ways to Form Flexible Counter Electrodes on Ti Metallic Sheets for Flexible Dye-Sensitized Solar Cells, ” 2013 Materials Research Society (MRS) Fall Meeting, Boston, Massachusetts, USA (2013)
C42. Hsin-Fang Lee, Yi-Ting Chua, Fan-Yi Ouyang and Ji-Jung Kai, “Comparison of Different Concentration of TiO2 Pastes for Quasi-Solid State All Plastic Dye-Sensitized Solar Cells, ” 2013 Materials Research Society (MRS) Fall Meeting, Boston, Massachusetts, USA (2013)
C43. Shih-Hsun Lin and Fan-Yi Ouyang, “Improved electromigration resistance of Pb-free solders by using Cu/Sn composite structure” 2014 The Minerals, Metals & Materials Society (TMS) Meeting, San Diego, CA, USA ( 2014)
C44. Chung-Hsun Tsai and Fan-Yi Ouyang, “Effect of joint thickness on cu consumption for pb-free solders under current stressing,” 2014 The Minerals, Metals & Materials Society (TMS) Meeting, San Diego, CA, USA ( 2014)
C45. Wei-Neng Hsu and Fan-Yi Ouyang, “Effect of Sn grain orientation on the behavior thermomigration in Sn3.5Ag solders, ” 2014 The Minerals, Metals & Materials Society (TMS) Meeting, San Diego, CA, USA ( 2014)
C46. Fan-Yi Ouyang, Wei-Cheng Jhu and Hao Hsu “Electromigration and Thermomigration of Pb-free Microbumps in Three-dimensional Integrated Circuits Packaging,” International conference on Electronics Packaging (ICEP), Toyoma, Japan (2014)
