
Fan-Yi Ouyang (歐陽汎怡)
Professor
Department of Engineering and System Science
National Tsing Hua University
Associate Director
Center for nanotechnology, Material Science, and Microsystems
Office: Engineering and System Science Building, Room 509, (工科舊館509室)
No. 101, Sec. 2, Kuang-Fu Road, Hsinchu, Taiwan 30013, R.O.C
TEL: +886-3-5715131 ext 34321
Email: fyouyang@ess.nthu.edu.tw
Professor
Department of Engineering and System Science
National Tsing Hua University
Associate Director
Center for nanotechnology, Material Science, and Microsystems
Office: Engineering and System Science Building, Room 509, (工科舊館509室)
No. 101, Sec. 2, Kuang-Fu Road, Hsinchu, Taiwan 30013, R.O.C
TEL: +886-3-5715131 ext 34321
Email: fyouyang@ess.nthu.edu.tw
Education
2002/06 B.Sc. Engineering & System Science, National Tsing Hua University, Taiwan, ROC
2004/06 M.Sc. Engineering & System Science, National Tsing Hua University, Taiwan, ROC
2007/12 Ph.D. Material Science & Engineering, University of California, Los Angeles, California, USA.
2004/06 M.Sc. Engineering & System Science, National Tsing Hua University, Taiwan, ROC
2007/12 Ph.D. Material Science & Engineering, University of California, Los Angeles, California, USA.
Professional Experience
08/2019 ~ Current Professor, National Tsing Hua University, Hsinchu, Taiwan
08/2014 ~ 08/2019 Associate professor, National Tsing Hua University, Hsinchu, Taiwan
08/2010 ~ 07/2014 Assistant professor, National Tsing Hua University, Hsinchu, Taiwan
12/2007 ~ 08/2010 Quality and reliability engineer, Portland technology development center, Intel Corporation, Oregon, USA
06/2007 ~ 09/2007 Electronic Packaging Failure Analysis Internship, Intel Corporation, Chandler, Arizona, USA
08/2014 ~ 08/2019 Associate professor, National Tsing Hua University, Hsinchu, Taiwan
08/2010 ~ 07/2014 Assistant professor, National Tsing Hua University, Hsinchu, Taiwan
12/2007 ~ 08/2010 Quality and reliability engineer, Portland technology development center, Intel Corporation, Oregon, USA
06/2007 ~ 09/2007 Electronic Packaging Failure Analysis Internship, Intel Corporation, Chandler, Arizona, USA
Research Interests
● Microelectronic materials and processing 微電子材料與製程
● Thin film deposition and characterization 薄膜製程與分析
● Mass transport (diffusion) and interfacial reaction 固態擴散與界面反應
● Electromigration, Thermomigration, and Stress migration 電遷移、熱遷移、應力遷移效應
● Pb-free solders and Cu interconnect 無鉛銲錫與銅內接線路
● Thin film deposition and characterization 薄膜製程與分析
● Mass transport (diffusion) and interfacial reaction 固態擴散與界面反應
● Electromigration, Thermomigration, and Stress migration 電遷移、熱遷移、應力遷移效應
● Pb-free solders and Cu interconnect 無鉛銲錫與銅內接線路