林玉芳
Tel: 886-3-5715131 ext 35812
Room 406, ESS new building
Tel: 886-3-5715131 ext 35812
Room 406, ESS new building
M. Sc Students
Chung-Hsun Tsai 蔡宗勳
s62211b@hotmail.com Received his Master degree in July, 2014. Thesis topics: Effect of joint thickness on void formation and intermetallic compound dissolution for Pb-free solders under current stressing(在電遷移環境中銲錫高度對無鉛銲錫孔洞生成及介金屬化合物溶解的影響) Currently in the military service. |
Shih-Hsun Lin 林士勛
XXL161@hotmail.com Received his Master degree in July, 2014. Thesis topics: Enhanced electromigration resistance of Pb-free solders by using Cu/Sn composite structure(使用銅錫複合結構提升無鉛銲錫電遷移抗性之研究) Currently work at UMC as a R.D. |
Yu-Ping Su 蘇育平
suipee@gmail.com Received his Master degree in July, 2014. Thesis topics: Effect of temperature gradient on the growth of Ag3Sn IMCs in Pb-free solder during liquid- and solid- state aging process(在液態及固態無鉛銲錫中 溫度梯度對Ag3Sn介金屬化合物成長的 影響) Currently work at TSMC. |
Wei-Neng Hsu 徐煒能
(Steven Hsu) steven79812@gmail.comReceived his Master degree in July, 2014. Thesis topics: Effects of anisotropic Beta-Sn alloys on Cu diffusion under a temperature gradient(在溫度梯度環境中錫之非等向性對銅原子擴散的影響) Currently in the military service. |
Hao Hsu 徐皓
u942103@oz.nthu.edu.tw Received his Master degree in July, 2012. Thesis topics: Electromigraiton induced failure on lead-free microbumps in three-dimensional integrated circuits packaging. (三維立體封裝結構中之微型銲錫電遷移破壞機制 ) Currently work at Applied Materials as a Process Engineer. |
Wei-Chen Ju 朱偉誠
hsmk1018@gmail.com Received his Master degree in January, 2013. Thesis topics: Study of thermomigration on lead-free micro bump in three-dimensional integrated circuits packaging(三維立體封裝結構中微型銲錫接點熱遷移之研究) Currently in the military service. |
Tzu-Yang Lin 林子楊
et322002@hotmail.com Received his Master degree in July, 2013. Thesis topics: Effect of temperature on thermomigration of composite 95%Pb5%Sn-eutectic SnPb solder joints in flip chip technology.(環境溫度對於覆晶封裝中錫鉛焊錫熱遷移之影響) Currently in the military service. |
Kai Hung Yang 楊凱鴻
hell3300071@yahoo.com.tw Received his Master degree in July, 2013. Thesis topics: The microstructure and properties of nanotwinned Cu thin films deposited by unbalanced magnetron sputtering system.(非平衡磁控濺鍍系統鍍著之奈米雙晶銅薄膜其微結構與性質之研究) Currently in the military service. |
Zong Han Yang 楊宗翰
d9683229@gmail.com Tel: 886-3-5715131 ext 35812 Room 406, ESS new building Received his Master degree in July, 2013. Thesis topics: Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules.(絕緣閘雙極性電晶體模組中之銅-鋁楔型打線在電遷移實驗下之破壞機制) Currently work at department of engineering and system science as a research assistant. |
Wei-Lun Tai 戴偉倫
net00825@hotmail.com Tel: 886-3-5715131 ext 35812 Room 406, ESS new building Thesis topics: Enhanced performance and long-term stability of dye-sensitized solar cells by sputterd TiN thin films.(非平衡磁控濺鍍氮化鈦奈米晶薄膜以提升染料敏化太陽能電池效率與長效性) Currently in the military service. |
B. Sc Students
Christine Young 楊沛欣
Received her B. Sc degree in June, 2012. Currently pursue her master degree at University of Californica, Los Angeles |
Samantha Yuan 袁萃
Received her B. Sc degree in June, 2012. Currently a research assistant in Dept of Engineering and System Science, National Tsing Hua University |
蘇子翔
Received his B. Sc degree in June, 2013. 
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