ETFP Lab Latest News 最新消息
- 2019/11/08 恭喜碩士生卓峰毅同學碩士口試順利通過 ~
- 2019/10/22 恭賀張孫易、戴詠庭榮獲 2019 Taiwan-Japan Workshop on Electronic Interconnection Best Poster Award
- 2019/09/27 恭賀博士生王建傑同學 榮獲2019原科院海報競賽(低碳綠能與環境科學組) 優勝
- 2019/09/27 恭賀碩士生吳柏賢同學 榮獲2019原科院海報競賽(低碳綠能與環境科學組) 優勝
- 2019/09/27 恭賀碩士生林璁同學 榮獲2019原科院海報競賽(光電半導體應用組) 優勝
- 2019/09/27 恭賀碩士生鍾靜儀同學 榮獲2019原科院海報競賽(核能與輻射應用組) 優勝
- 2019/09/27 恭賀碩士生蔡維東同學 榮獲2019原科院海報競賽(低碳綠能與環境科學組) 佳作
- 2019/08 恭喜碩士生戴詠庭、李柔萱、方鈺淇同學碩士口試順利通過 ~
- 2019/05/28 恭賀歐陽汎怡教授 榮獲清華大學107學年度校傑出教學獎
- 2018/10/23 恭賀博士生張樂平同學 榮獲2018台灣鍍膜科技協會年會學生口頭論文競賽第一名
- 2018/09/20 恭賀碩士生李承威同學 榮獲2018原科院海報競賽(光電半導體應用組) 優等
- 2018/09/20 恭賀碩士生張孫易同學 榮獲2018原科院海報競賽(低碳綠能與環境科學組) 優等
- 2018/09/20 恭賀碩士生郝昱筌同學 榮獲2018原科院海報競賽(光電半導體應用組) 優等
- 2017/12/14 恭賀碩士生方鈺淇同學、曹嚴文同學 榮獲2017 IUMRS-ICA『最佳研究生海報論文獎』
- 2017/09/21 恭賀碩士生李柔萱同學 榮獲2017原科院海報競賽優等
- 2017/09/21 恭賀碩士生戴詠庭同學 榮獲2017原科院海報競賽佳作
- 2017/03/15 恭賀歐陽汎怡教授榮獲 原科院105學年度第九屆傑出導師獎
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Introduction
Our research interest is in Si-based and diffusion driven materials science for modern microelectronic, opto-electronic, bio-sensor, and MEMS devices. The research in our lab currently focuses on the following topics but are not limited to:
● Diffusion mechansim and microstructural evolution under current stressing (Electromigration), a
temperature gradient(Thermomigration), and a stress gradient (Stress-migration) on the Pb-free solders utilizied in the flip chip and three-dimensional intergrated circuits (3D IC) technologies
● Fabrication of Cu nano-thin film and diffusion mechanism of Cu under current Stressing
● Chemical reaction and kinectic mechanism between under-bump metallization and Sn
本實驗室的研究將會專注於微電子覆晶封裝與三維立體封裝(3D IC)技術中的擴散驅動的材料科學研究，目前研究題目包含無鉛銲料材料受到電流(電遷移),溫度梯度(熱遷移)及應力梯度(應力遷移)下的擴散行為、材料微結構變化、及界面化學反應之探討，進而研究其破壞模式與動力學分析。此外，本實驗室研究也包含奈米銅薄膜的鍍著，性質與微結構變化研究及對半導體產業的可靠度影響。實驗室成員將從研究中了解且學習到電子封裝之基本概念及在半導體產業之應用,微電子材料與製程方法,及材料分析技術等，歡迎有興趣的同學加入我們的行列 !!
* We are recruiting graduate and undergraduate research assistants. The projects include, reliability issues of 3D IC technology, interfacial reaction and reliability issue for Cu wire technology, Cu thin film fabrication and characterization, and developing the flexible dye-sensitized solar cells. Please contact Prof. Fan-Yi Ouyang (fyouyang@ess.nthu.edu.tw) directly.
● Diffusion mechansim and microstructural evolution under current stressing (Electromigration), a
temperature gradient(Thermomigration), and a stress gradient (Stress-migration) on the Pb-free solders utilizied in the flip chip and three-dimensional intergrated circuits (3D IC) technologies
● Fabrication of Cu nano-thin film and diffusion mechanism of Cu under current Stressing
● Chemical reaction and kinectic mechanism between under-bump metallization and Sn
本實驗室的研究將會專注於微電子覆晶封裝與三維立體封裝(3D IC)技術中的擴散驅動的材料科學研究，目前研究題目包含無鉛銲料材料受到電流(電遷移),溫度梯度(熱遷移)及應力梯度(應力遷移)下的擴散行為、材料微結構變化、及界面化學反應之探討，進而研究其破壞模式與動力學分析。此外，本實驗室研究也包含奈米銅薄膜的鍍著，性質與微結構變化研究及對半導體產業的可靠度影響。實驗室成員將從研究中了解且學習到電子封裝之基本概念及在半導體產業之應用,微電子材料與製程方法,及材料分析技術等，歡迎有興趣的同學加入我們的行列 !!
* We are recruiting graduate and undergraduate research assistants. The projects include, reliability issues of 3D IC technology, interfacial reaction and reliability issue for Cu wire technology, Cu thin film fabrication and characterization, and developing the flexible dye-sensitized solar cells. Please contact Prof. Fan-Yi Ouyang (fyouyang@ess.nthu.edu.tw) directly.
